Rogers RO3206 2-Layer 50mil High-Frequency RF PCB with Immersion Gold
1.Introduction of RO3206
Rogers' RO3206 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3206 high-frequency materials were designed as an extension of the RO3000 series, with one distinguishing characteristic: improved mechanical stability.
2.Key Features
Dielectric constant of 6.15 with tight tolerance 0.15 at 10 GHz/23°C
Dissipation factor of 0.0027 at 10GHz
High thermal conductivity of 0.67 W/MK
Low moisture absorption less than 0.1%
Matched to copper CTE in X-axis (13 ppm/°C), Y-axis (13 ppm/°C), and Z-axis (34 ppm/°C)
Strong copper peel strength of 10.7 lbs/in
3.Benefits
Woven glass reinforcement – Improves rigidity for easier handling
Uniform electrical and mechanical performance – Ideal for complex multi-layer high-frequency structures
Low dielectric loss – Enhances high-frequency performance
Low in-plane expansion coefficient (matched to copper) – Suitable for hybrid designs and reliable surface-mounted assemblies
Excellent dimensional stability – Ensures high production yields
Economically priced – Supports cost-effective volume manufacturing
Surface smoothness – Allows for finer line etching tolerances
4.PCB Construction Details
| Specification | Value |
|---|---|
| Base Material | RO3206 |
| Layer Count | 2-layer |
| Board Dimensions | 90.92mm × 53.03mm (±0.15mm) |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 1.4mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 µm
RO3206 – 1.27 mm (50 mil)
Copper layer 2 – 35 µm
6.PCB Statistics:
Components: 36
Total Pads: 59
Thru Hole Pads: 27
Top SMT Pads: 32
Bottom SMT Pads: 0
Vias: 33
Nets: 2
7.Typical Applications
Automotive collision avoidance systems
Automotive GPS satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
